IEEE SmartGridComm Symposium on

Standardization, Interoperability and Coexistence

Symposium Co-Chairs
Dick De Blasio National Renewable Energy Laboratory (NREL), USA	Lutz Lampe University of British Columbia, Canada
Wayne Longcore Consumers Energy, USA	David Su NIST, USA

Scope and Motivation

The pursuit of a smart, intelligent grid is fast moving from power-points and designs to pilot projects testing physical performance. Deployment of various aspects of smart grid is on their way globally. Without standards there is the danger that these investments become prematurely obsolete, or be implemented without due security measures. In the U.S., the national institute of standards and technology has recognized the importance of this issue, and is pursuing the standardization process aggressively. Similar efforts are underway in standardization bodies around the world to accelerate the identification of the standards, establish a robust framework for the standards evolution, and device testing and certification.

Topics of Particular Interest

This symposium aims to explore different aspects of standardization, interoperability, and coexistence for smart grid's emerging technologies. The topics of this symposium include, but are not limited to, the following:

1. Smart meter upgradability standard
2. Adapting the IP protocol
3. Standard for energy use information
4. Scheduling mechanisms for energy transaction
5. Standard signalling for demand response management
6. Time synchronization
7. Interoperability of wireless standards
8. Power line communications (PLC) coexistence
9. Standard meter data profiles
10. Interoperability of the standards to support plug-in-electric vehicles (PEVs)

Submission Guidelines

Submission deadlines and format requirements are the same for all symposia, see here

Papers can be submitted here

Technical Program Committee (TPC) Members

Farooq Anjum, On-Ramp Wireless, USA
Tom Basso, NREL, USA
Salvador Iranzo, DS2, Spain
Joon Bae Kim, Lantiq, USA
Tetsu Koyama, Xingtera Inc., Japan
Jim LeClare, Maxim Integrated Products, USA
Bill Miller, Mac-CT USA, USA
Peter Mueller, IBM Zurich Research Laboratory, Switzerland
Barry O'Mahony, Intel Corporation, USA